Resistance variable memory sensing using programming signals

ABSTRACT

Apparatuses and methods for sensing a resistance variable memory cell include circuitry to apply a programming signal to a memory cell in the array, the programming signal associated with programming resistance variable memory cells to a particular data state, and detect a change in resistance of the memory cell to determine if a data state of the memory cell changes from an initial data state to a different data state during application of the programming signal.

PRIORITY INFORMATION

This application is a Continuation of application Ser. No. 15/635,814,filed on Jun. 28, 2017, which is a Divisional of U.S. application Ser.No. 13/869,571 filed Apr. 24, 2013, and issued as U.S. Pat. No.9,728,251 on Aug. 8, 2017, the specification of which is incorporatedherein by reference.

RELATED APPLICATIONS

The present application is related to U.S. patent application Ser. No.13/869,512, filed on Apr. 24, 2013, entitled “Resistance Variable MemorySensing,” having attorney docket number 1002.1390001.

TECHNICAL FIELD

The present disclosure relates generally to apparatuses, such assemiconductor memory devices, systems, and controllers, and relatedmethods, and more particularly, to sensing resistance variable memorycells.

BACKGROUND

Memory devices are typically provided as internal, semiconductor,integrated circuits and/or external removable devices in computers orother electronic devices. There are many different types of memoryincluding random-access memory (RAM), read only memory (ROM), dynamicrandom access memory (DRAM), synchronous dynamic random access memory(SDRAM), flash memory, and resistance variable memory, among others.Types of resistance variable memory include programmable conductormemory, phase change random access memory (PCRAM), resistive randomaccess memory (RRAM), magnetoresistive random access memory (MRAM; alsoreferred to as magnetic random access memory), conductive-bridgingrandom access memory (CBRAM), and spin torque transfer random accessmemory (STT RAM), among others.

Non-volatile memory may be used in, for example, personal computers,portable memory sticks, solid state drives (SSDs), personal digitalassistants (PDAs), digital cameras, cellular telephones, portable musicplayers (e.g., MP3 players) and movie players, among other electronicdevices. Data, such as program code, user data, and/or system data, suchas a basic input/output system (BIOS), are typically stored innon-volatile memory devices.

Resistance variable memory, such as RRAM or STT RAM, includes resistancevariable memory cells that can store data based on the resistance stateof a storage element (e.g., a memory element having a variableresistance). As such, resistance variable memory cells can be programmedto store data corresponding to a target data state by varying theresistance level of the memory element. Resistance variable memory cellscan be programmed to a target data state (e.g., corresponding to aparticular resistance state) by applying a programming signal to theresistance variable memory cells. Programming signals can includeapplying sources of an electrical field or energy, such as positive ornegative electrical pulses (e.g., positive or negative voltage orcurrent pulses) to the cells (e.g., to the memory element of the cells)for a particular duration.

A resistance variable memory cell can be programmed to one of a numberof data states. For example, a single level cell (SLC) may be programmedto one of two data states, a low resistance state that corresponds to aparallel state (e.g., logic 0), or a high resistance state thatcorresponds to an anti-parallel state (e.g., logic 1). The data state ofthe memory cell can depend on whether the cell is programmed to aresistance above or below a particular level. As an additional example,various resistance variable memory cells can be programmed to one ofmultiple different data states corresponding to different resistancelevels. Such cells may be referred to as multi state cells, multi-digitcells, and/or multilevel cells (MLCs), and can represent multiple binarydigits of data (e.g., 10, 01, 00, 11, 111, 101, 100, 1010, 1111, 0101,0001, etc.).

In some instances, a sensing operation used to determine the data stateof a resistance variable memory cell can incorrectly determine the datastate of the resistance variable memory cell. For example, a currentassociated with the memory cell during a sensing operation may or maynot correspond to a data state to which the memory cell was programmed,thus resulting in sensing an incorrect data state for the memory cell.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a portion of an array of resistancevariable memory cells according to a number of embodiments of thepresent disclosure.

FIG. 2 illustrates a block diagram of components for determining a datastate of a resistance variable memory cell according to a number ofembodiments of the present disclosure.

FIG. 3 illustrates a chart indicating the phases in determining a datastate of a resistance variable memory cell according to a number ofembodiments of the present disclosure.

FIG. 4 illustrates circuitry for determining a data state of aresistance variable memory cell according to a number of embodiments ofthe present disclosure.

FIG. 5 illustrates circuitry for determining a data state of aresistance variable memory cell according to a number of embodiments ofthe present disclosure.

FIG. 6 illustrates circuitry for determining a data state of aresistance variable memory cell according to a number of embodiments ofthe present disclosure.

FIG. 7 illustrates a block diagram of an apparatus in the form of amemory device according to a number of embodiments of the presentdisclosure.

DETAILED DESCRIPTION

The present disclosure includes apparatuses and methods for sensing aresistance variable memory cell. A number of embodiments includecircuitry to apply a programming signal to a memory cell in the array,the programming signal associated with programming resistance variablememory cells to a particular data state, and detect a change inresistance of the memory cell to determine if a data state of the memorycell changes from an initial data state to a different data state duringapplication of the programming signal.

Embodiments described herein can, for example, reduce sensing (e.g.,reading) errors and/or increase the speed of a sensing operation ascompared to previous approaches. For example, sensing operations inprevious approaches can result in sensing errors due to memory cellshaving a resistance associated with a data state other than the datastate associated with the programming signal that was used to programthe memory cell. Also, to avoid sensing errors due to memory cellshaving a resistance associated with a data state other than the datastate associated with the programming signal that was used to programthe memory cell, previous memory cell sensing approaches can include anumber of steps to determine the data state of a memory cell that can betime consuming. For example, previous approaches can include sensing thedata state of the memory cell, programming the memory cell to a knowndata state, and finally sensing the data state of the memory cell againto determine the initial data state of the memory cell. Embodiments ofthe present disclosure can sense memory cells with increased speed andwith fewer errors than previous approaches by applying a programmingsignal to the memory cell and determining if a change in resistance ofthe memory cell occurs.

In the following detailed description of the present disclosure,reference is made to the accompanying drawings that form a part hereof,and in which is shown by way of illustration how a number of embodimentsof the disclosure may be practiced. These embodiments are described insufficient detail to enable those of ordinary skill in the art topractice the embodiments of this disclosure, and it is to be understoodthat other embodiments may be utilized and that process, electrical,and/or structural changes may be made without departing from the scopeof the present disclosure. As used herein, “a number of” something canrefer to one or more of such things. For example, a number of memorydevices can refer to one or more memory devices. As used herein, thedesignators “N” and “M”, particularly with respect to reference numeralsin the drawings, indicates that a number of the particular feature sodesignated can be included with a number of embodiments of the presentdisclosure.

The figures herein follow a numbering convention in which the firstdigit or digits correspond to the drawing figure number and theremaining digits identify an element or component in the drawing.Similar elements or components between different figures may beidentified by the use of similar digits. For example, 250 may referenceelement “50” in FIG. 2, and a similar element may be referenced as 450in FIG. 4. As will be appreciated, elements shown in the variousembodiments herein can be added, exchanged, and/or eliminated so as toprovide a number of additional embodiments of the present disclosure. Inaddition, as will be appreciated, the proportion and the relative scaleof the elements provided in the figures are intended to illustrate theembodiments of the present invention, and should not be taken in alimiting sense.

FIG. 1 is a block diagram of a portion of an array 100 of resistancevariable memory cells 106 according to a number of embodiments of thepresent disclosure. In the example illustrated in FIG. 1, array 100 is across-point array having resistance variable memory cells 106 located atthe intersections of a first number of conductive lines 102-1, 102-2, .. . , 102-N (e.g., access lines, which may be referred to herein as wordlines), and a second number of conductive lines 104-1, 104-2, . . . ,104-M (e.g., data/sense lines, which may be referred to herein as bitlines). As illustrated in FIG. 1, word lines 102-1, 102-2, . . . , 102-Nare substantially parallel to each other and are substantiallyorthogonal to bit lines 104-1, 104-2, . . . , 104-M, which aresubstantially parallel to each other; however, embodiments are not solimited. In the embodiment illustrated in FIG. 1, resistance variablememory cells 106 can function in a two-terminal architecture (e.g., witha particular word line 102-1, 102-2, . . . , 102-N and bit line 104-1,104-2, . . . , 104-M serving as a bottom and top electrode for the cell106).

Each resistance variable memory cell 106 can include a storage element(e.g., a resistance variable memory element) coupled (e.g., in series)to a select device (e.g., an access device). The access device can be,for example, a diode or a transistor (e.g., a field effect transistor(FET) or bipolar junction transistor (BJT)), among others. The storageelement can include a programmable portion that may have a variableresistance, for example. The memory cell 106 can be a spin torquetransfer random access memory (STT RAM) cell and include magnetic tunneljunction, for example. For instance, the storage element can include oneor more resistance variable materials (e.g., a material programmable tomultiple different resistance states, which can represent multipledifferent data states) such as, for example, a transition metal oxidematerial, or a perovskite including two or more metals (e.g., transitionmetals, alkaline earth metals, and/or rare earth metals). Other examplesof resistance variable materials that can be included in the storageelement of resistance variable memory cells 106 can include variousmaterials employing trapped charges to modify or alter conductivity,chalcogenides formed of various doped or undoped materials, binary metaloxide materials, colossal magnetoresistive materials, and/or variouspolymer based resistance variable materials, among others. Embodimentsare not limited to a particular resistance variable material ormaterials. As such, resistance variable memory cells 106 can be singlelevel and/or multilevel resistive random access memory (RRAM) cells,spin torque transfer random access memory (STT RAM) cells, programmableconductor memory cells, phase change random access memory (PCRAM) cells,magnetoresistive random access memory cells, and/or conductive-bridgingrandom access memory (CBRAM) cells, among various other types ofresistance variable memory cells.

In operation, resistance variable memory cells 106 of array 100 can beprogrammed via programming signals (e.g., write voltage and/or currentpulses) applied to the cells (e.g., the storage element of the cells)via selected word lines 102-0, 102-1, . . . , 102-N and bit lines 104-0,104-1, . . . , 104-M. The magnitude (e.g., amplitude), duration (e.g.,width), and/or number of programming pulses, for example, applied toresistance variable memory cells 106 can be adjusted (e.g., varied) inorder to program the cells to one of a number of different resistancelevels corresponding to particular data states.

In a number of embodiments, a single level resistance variable memorycell may be programmed to one of two data states (e.g., logic 1 or 0).The memory cell may be programmed with a first programming signal, whichwill place the cell in a low resistance data state (e.g., logic 0) orthe memory cell may be programmed with a second programming signal,which will place the cell in a relatively higher resistance data state(e.g., logic 1). In a number of embodiments, the difference inresistance between the low data resistance state and the high resistancedata state of a memory cell can be referred to as the reading window.For example, a memory cell in the high resistance data state can have aresistance that is 10 times more that the resistance of the memory cellin the low resistance data state, therefore the reading window for thememory cell can be 10 times the low resistance level. Embodiments in thepresent disclosure are not limited to a particular reading window andthe reading window can include a number of differences in resistancebetween a high resistance data state and a low resistance data state.

A sensing (e.g., read and/or program verify) operation can be used todetermine the data state of a resistance variable memory cell 106 (e.g.,the resistance state of the storage element of a resistance variablememory cell 106) by sensing (e.g., read) a signal, for example, on a bitline 104-0, 104-1, . . . , 104-M associated with the respective cellresponsive to a particular voltage applied to the selected word line102-0, 102-1, . . . , 102-N to which the selected cell is coupled.Sensing the signal associated with the respective cell can includesensing a voltage, a current, an amplitude, and/or a slope (e.g. a timederivative of a parameter of the signal) of the signal, among othercharacteristics of the signal. In a number of embodiments where a memorycell includes a 3-terminal select device, a word line voltage can beused to select the memory cell and a signal through memory cell can bechanged by voltage difference between a bit line and a source of theselected memory cell to vary the resistance level of the memory cell,for example A sensing operation can incorrectly determine the data stateof a resistance variable memory cell when the resistance associated withthe memory cell during the sensing operation corresponds approximatelyto a resistance associated with a data state that is different from thedata state associated with the programming signal that was used toprogram the memory cell to an initial state.

A sensing operation according to a number of embodiments of the presentdisclosure can reduce sensing errors associated with a cell having aresistance associated with two or more data states and/or decrease thetime to perform a sensing operation. Previous approaches includedsensing operations resulted in sensing errors or reduced sensing errors,but involved a number of time intensive steps that include two sensingoperations and a programming operation to determine the data state ofthe memory cell. In a number of embodiments, a method for sensing aresistance variable memory cell can include applying a programmingsignal to the memory cell and determining the data state of the memorycell by determining whether the data state of the memory cell changeswhile applying the programming signal. Changes in the data state of thememory while applying the programming signal can be determined by usinga change determination component, e.g., circuitry, to determine if achange in the signal associated with the memory cell occurred whileapplying the programming signal. For example, determining the data stateof the memory cell can include determining that the data state of thememory cell is a data state associated with the programming signalapplied to the memory cell when the determined change in the signalassociated with the memory cell is less than a threshold amount anddetermining that the data state of the memory cell is a data statedifferent from the data state associated with the programming signalapplied to the memory cell when the determined change in the signalassociated with the memory cell is greater than or equal to a thresholdamount.

In a number of embodiments, a method for sensing a resistance variablememory cell can include applying a programming signal to the memory celland determining the data state of the memory cell by detecting changesin resistance of the memory cell while the programming signal is appliedto the memory cell using circuitry described herein.

FIG. 2 illustrates a block diagram of components for determining a datastate of a resistance variable memory cell according to a number ofembodiments of the present disclosure. FIG. 2 includes memory cells 206and the decoding means to select one of the memory cells that receives aprogramming signal from signal generator 214. The programming signalfrom signal generator 214 can be a programming signal used to programmemory cells to a particular data state. The programming signal can beramped through a number of currents and/or voltages used to programmemory cells to the particular data state. As a result of applying aprogramming signal to memory cell 206, bit line 204 includes signal (S)212 associated with memory cell 206. Signal 212 associated with memorycell 206 can be detected using circuitry described in association withFIG. 2 to determine a data state of the memory cell 206 based on changesin resistance of the memory cell 206.

Signal 212 can be input into a voltage buffer 210 and a high pass filter220. The voltage buffer 210 can drive the high pass filter withoutloading bit line 204 with additional capacitances. Signal 212-1 can passthrough the voltage buffer 210 and the voltage buffer can output signal212-2 (S₂). Signal 212-2 can pass through high pass filter 220 and thehigh pass filter 220 can output signal 212-3 (S₃). Signal 212-3 can beinput from the high pass filter 220 into the DC voltage generator 240,which is used to generate a DC signal, signal 212-4 (S₄), which is equalto signal 212-3. Signal 212-3 is sampled by circuitry 230 to generate areference signal, signal 212-5 (S₅). The high pass filter 220 is used tosuperimpose an AC signal to signal 212-3 and signal 212-4 during theprogramming pulse as result of the change of the resistance from a highresistive state to a low resistive state. Signal 212-4 can be input fromthe DC voltage generator 240 into comparator circuitry 250 that includesa pre-amplifier, a comparator, and/or other circuitry including somereset logic. For example, DC voltage generator 240 can include aninverter that is closed at its trip point where its input, signal 212-3,is short-circuited to its output, signal 212-4, to generate a DC signal,signal 212-4, that is equal to the input signal 212-3.

Circuitry 230 can include a filter, a capacitor, and a number ofswitches. In a number of embodiments, the filter, the capacitor, and thenumber of switches can be used to filter out noise from the signal 212-3as signal 214 is initially applied to memory cell 206 thus generatingsignal 212-1. In a number of embodiments, signal 212-3 can be sampled onthe capacitor during a first time period via the opening and closing ofa number of switches, thus generating the signal 212-5, which is areference replica to be used by the comparator 250 in a subsequentsecond time period against the signal 212-4, which is thesuperimposition of an AC signal to a DC signal. If a change in the stateof the resistance of the cells happen during a second period, thecorresponding AC signal is large enough to make signal 212-4 to bedifferent from its sampled reference replica 212-5 stored during a firstperiod, thus becoming a large enough detectable input by the comparator250, that includes a pre-amplifier, a comparator, and/or othercircuitry, whose output will change from the reset state to the setstate. If no change in the state of the resistance of the cells happensalong with the whole programming pulse, the AC signal is small enough orequal to zero thus leaving signal 212-4 to be very close to or equal tothe 212-5 sampled at a first time, thus having a small enough input tothe comparator to be undetectable and leaving it to its reset state. Forinstance, the amplitude of the AC voltage signal 212-1 is basicallydetermined by the product Rcell(t)*I, where I is the applied programmingcurrent 214 and Rcell is the cell resistance at a given time t; if theRcell(t) changes from high resistance state to low resistance stateRcell(t+dt), where Rcell(t+dt) is typically close to half of Rcell(t), avoltage drop of about ½*Rcell(t)*I is suddenly happening on top of astable bit line voltage level, thus generating the AC signal. This ACsignal 212-2 is then transferred through the high pass filter 220, whichoutputs signal 212-3 and then superimposed to the DC signal level ofsignal 212-4, which stops the stable bit line voltage level.

In a number of embodiments, the comparator circuitry 250 can include anumber of inverters to detect resistance changes in memory cell 206. Asignal can be output from the number of inverters to circuitry in thecomparator circuitry 250. The comparator circuitry 250 can detectchanges in the resistance of the memory cell 206 based on the input fromthe number of inverters and an output from the comparator circuitry 250can be input into latch and/or flip-flop 260 to determine the data stateof the memory cell. The output 262 (Data Out) of latch and/or flip-flop260 can indicate whether the data state of the memory cell changed dueto the application of the programming signal to the memory cell 206. Forinstance, output 262 can be set to a data state 1 by the comparator froman initial data state 0, where the initial data state 0 was a result ofa previously issued reset. As such, if the output 262 indicates the datastate changed, the memory cell can be reprogrammed to its initial datastate. Embodiments using a number of inverters to detect resistancechanges in a memory cell will be described in more detail below inassociation with FIG. 4.

In a number of embodiments, the comparator circuitry 250 can includecircuitry that receives signal 212-4 associated with memory cell 206 anda previously sampled voltage associated with memory cell 206, which issignal 212-5, to detect resistance changes in memory cell 206, whichwill be described in more detail below in association with FIG. 5.Signal 212 associated with memory cell 206 can be input to a comparatorin the comparator circuitry 250, along with a previously sampled voltageassociated with the memory cell 206. Those inputs can be used by thecomparator to detect changes in resistance of the memory cell 206 and anoutput from the comparator can be input into latch 260 to determine thedata state of the memory cell 206. The output 262 (Data Out) of latch260 can indicate whether the data state of the memory cell changed dueto the programming signal. As such, if the output 262 indicates the datastate changed, the memory cell can be reprogrammed to its initial datastate.

In a number of embodiments, the comparator circuitry 250 can includecircuitry that receives signal 212 associated with memory cell 206 and areference voltage to detect changes in resistance of the memory cell206, which will be described in more detail below in association withFIG. 6. A signal associated with a drop in resistance of memory cell 206and a signal associated with the reference signal can be input to acomparator in the comparator circuitry 250. Those inputs can be used bythe comparator to detect changes in the resistance of the memory cell206 and an output from the comparator can be input into latch 260 todetermine the data state of the memory cell 206. The output 262 (DataOut) of latch 260 can indicate whether the data state of the memory cellchanged due to the programming signal. As such, if the output 262indicates the data state changed, the memory cell can be reprogrammed toits initial data state.

In an example in which the memory cell is an STT memory cell, theparticular programming signal can be a programming signal used toprogram the memory cell to a parallel state. An occurrence of a changein the resistance of the memory cell may be detected if the initial datastate of the memory cell is an anti-parallel data state and theparticular programming signal is a programming signal used to programmemory cells to a parallel state; therefore, detecting that a change inthe resistance of the memory cell occurred would indicate that thememory cell is not at the particular data state (e.g., parallel datastate), but at a different data state (e.g. anti-parallel data state). Adetected change in resistance of the memory cell can indicate a datastate change for the memory cell during the application of theprogramming signal, therefore the memory cell can be programmed back toits initial state. For example, a programming signal associated withprogramming memory cells to the anti-parallel data state can be appliedto the memory cell to return the memory cell to the initial data state.

For example, during implementation of the embodiments illustrated inFIG. 2, the particular programming signal can be incrementally rampedthrough a number of programming signal values that are used to programmemory cells to the particular data state. The particular programmingsignal can be incrementally ramped until a determination that a changein the current and/or voltage associated with the memory cell occurred,a maximum programming signal value is reached, or a maximum time periodfor applying the particular programming signal is reached.

FIG. 3 illustrates a chart indicating the phases in determining a datastate of a resistance variable memory cell according to a number ofembodiments of the present disclosure. In FIG. 3, a first phase (φ₀) 341includes applying a programming signal on a memory cell by starting acurrent ramp. The programming signal can be incrementally ramped througha number of programming signal values that are used to program memorycells to a particular data state. The programming signal can be appliedfor a time period 340 during the first phase 341. The particularprogramming signal can be incrementally ramped until a determinationthat a change in the current associated with the memory cell occurred, amaximum programming signal value is reached, or a maximum time periodfor applying the particular programming signal is reached, e.g., timeperiod 340.

In FIG. 3, a second phase (φ₁) 343 includes filtering and sampling asignal associated with a memory cell. The signal can be filter andsampled using circuitry, e.g., circuitry 230 in FIG. 2. The signal canbe filtered and sampled during a time period 342. Time period 342 can beduring a first portion of time period 340.

In FIG. 3, a third phase (φ₂) 345 includes comparing signals todetermine the data state of a memory cell. Comparing signals todetermine the data state of the memory cell can be completed by usingcircuitry, e.g., comparator circuitry 250, 450, 550, and/or 660 in FIGS.2, 4, 5 and/or 6. Signals can be compared during a time period 344. Timeperiod 344 can be during a second portion of time period 340 and aftertime period 342.

In FIG. 3, a fourth phase (φ₃) 347 includes resetting the comparator andlatching the data state to a latch. Resetting the comparator andlatching the data state to a latch can be completed during a time period346. Time period 346 can be during a third portion of time period 340and during the end of time period 344.

FIG. 4 illustrates circuitry 450 for determining a data state of aresistance variable memory cell according to a number of embodiments ofthe present disclosure. FIG. 4 includes inverters 452, 454, 456-1,456-2, 456-3, 458-1, 458-2, and 458-3, which can be part of comparatorcircuitry, e.g., comparator circuitry 250 in FIG. 2, used to determinethe data state of resistance variable memory cells. The circuitry 450can receive a signal associated with a memory cell from a DC voltagegenerator, e.g. DC voltage generator 240 in FIG. 2. The signalassociated with a memory cell can be passed through inverters 452 and454. Inverters 452 and 454 can be configured the same so they both passthe same signal, therefore inverters 456-1, 456-2, and 456-3, receivinga signal from inverter 452, and inverters 458-1, 458-2, and 458-3,receiving a signal from inverter 454, all receive the same “matched”signal.

Inverters 456-1, 456-2, and 456-3 can be configured to pass a signalwhen receiving a signal associated with the memory cell having a voltagethat corresponds to the memory cell at a data state that is differentfrom the particular data state associated with the programming signalapplied to the memory cell. Inverters 456-1, 456-2, and 456-3 can beconfigured to pass signals each with different voltages that correspondto a trip point of the data state that is different than the data stateassociated with the programming signal, but where each of the voltagesare within a range of voltages that are associated with the memory cellhaving a resistance corresponding to a data state that is different fromthe particular data state associated with the programming signal that isapplied to the memory cell. Therefore, a majority voting scheme can beused by inverters 456-1, 456-2, and 456-3, where if detection circuitry459 receives a signal from 2 of the 3 inverters 456-1, 456-2, and 456-3,the circuitry detects a change in resistance of the memory cell and cansend an output to a latch, indicating that the resistance of the memorycell corresponds to a data state that is different from the particulardata state associated with the programming signal that is applied to thememory cell. An output from the latch can indicate that the data stateof the memory cell changed due to the programming signal.

Inverters 458-1, 458-2, and 458-3 can be configured to pass a signalwhen receiving a signal associated with the memory cell having a voltagethat corresponds to the memory cell at a data state associated with theprogramming signal that is applied to the memory cell. Inverters 458-1,458-2, and 458-3 can each be configured to pass signals with differentvoltages that correspond to a trip point of the data state associatedwith the programming signal, but where each of the voltages are within arange of voltages that are associated with the memory cell having aresistance corresponding to a data state associated with the programmingsignal that is applied to the memory cell. Therefore, a majority votingscheme can be used by inverters 458-1, 458-2, and 458-3, where if thedetection circuitry 459 receives a signal from 2 of the 3 inverters458-1, 458-2, and 458-3, the circuitry does not detect a change inresistance of the memory cell and can send an output to a latch,indicating that the resistance of the memory cell corresponds to a datastate that is different from the particular data state associated withthe programming signal that is applied to the memory cell. An outputfrom the latch can indicate that the data state of the memory cell didnot change due to the programming signal. Although the embodimentsillustrated in FIG. 4 include sets of 3 inverters, embodiments of thepresent disclosure are not so limited and may include any number ofinverters.

FIG. 5 illustrates circuitry 550 for determining a data state of aresistance variable memory cell according to a number of embodiments ofthe present disclosure. FIG. 5 includes comparator 561, which can bepart of comparator circuitry, e.g., comparator circuitry 250 in FIG. 2,that is used to determine the data state of resistance variable memorycells. The comparator 561 can receive a signal 512 associated with amemory cell from a DC voltage generator, e.g. DC voltage generator 240in FIG. 2. The comparator 561 can also receive a signal 564, wheresignal 564 is a previously sampled signal that was sampled when theprogramming signal is initially applied to the memory cell, e.g. duringtime period 342 in FIG. 3. Signal 564 can be stored on a capacitor inputinto comparator 559 by using opening and closing a number of switches,e.g., circuitry 230 in FIG. 2.

In a number of embodiments, if the signals 512 and 564 and received bycomparator 561 have different voltages, comparator 561 can send anoutput to a latch indicating that the resistance of the memory cellcorresponds to a data state that is different from the particular datastate associated with the programming signal that is applied to thememory cell. An output from the latch can indicate that the data stateof the memory cell changed due to the programming signal.

In a number of embodiments, if the signals 512 and 564 received bycomparator 561 have the same voltage, e.g., the signal 512 and 564 havethe same magnitude, comparator 561 can send an output to a latch,indicating that the resistance of the memory cell corresponds to a datastate that is associated with the programming signal that is applied tothe memory cell. An output from the latch can indicate that the datastate of the memory cell did not change due to the programming signal.

FIG. 6 illustrates circuitry 660 for determining a data state of aresistance variable memory cell according to a number of embodiments ofthe present disclosure. The circuitry in FIG. 6 is a differentimplementation of the circuitry described in association with elements210, 220, 230, 240, and 250 in FIG. 2. Circuitry 660 can include diodes673 and 675 and capacitors 672 and 674 that are precharged with signalshaving the same voltage. Signal (S_(in)) 612 associated with the memorycell and signal (S_(ref)) 676, which is a reference signal having avoltage that increases as the current of the programming signalincreases, can be applied to circuitry 660.

The circuitry 660 can be configured so that as signal 676 is applied tothe circuitry 660, capacitor 672 does not discharge and an input intocomparator 661 is associated with the signal 676. The circuitry 660 canbe configured so that as signal 612 associated with a memory cell isapplied to the circuitry 660, the voltage of signal 612 will increase asthe current of the programming signal applied to the memory cellincreases so that capacitor 674 does not discharge and an input intocomparator 661 is associated with the signal 612 and matches the inputassociated with signal 676. While the programming signal is applied thememory cell, a drop in resistance of the memory cell can cause a drop inthe voltage of signal 612 being applied to circuitry 660 and circuitry660 can be configured so that the drop in voltage of signal 612 willcause capacitor 674 to discharge. Therefore, when the resistance of thememory cell drops while the programming signal is applied to the memorycell, a signal can be input into comparator 661 that is associated withthe capacitor 674. When the comparator 661 receives inputs that areassociated with signal 676 and 612 and match each other, the comparator661 can output a signal to a latch that indicates the resistance of thememory cell has not changed and the latch can output a signal thatindicates the data state of the memory cell did not change due to theprogramming signal. When the comparator 661 receives inputs that areassociated with signal 676 and with capacitor 674 that are differentfrom each other, the comparator 661 can output a signal to a latch thatindicates the resistance of the memory cell has changed and the latchcan output a signal that indicates the data state of the memory cellchanged due to the programming signal.

FIG. 7 illustrates a block diagram of an apparatus in the form of amemory device 710 according to a number of embodiments of the presentdisclosure. As shown in FIG. 7, memory device 710 includes a controller712 coupled to a memory array 700. As used herein, a memory system, acontroller, or a memory device might also be separately considered an“apparatus.” An “apparatus” can refer to, but is not limited to, any ofa variety of structures or combinations of structures, such as a circuitor circuitry, a die or dice, a module or modules, a device or devices,or a system or systems, for example.

Memory array 700 can be analogous to, for example, memory array 100previously described in connection with FIG. 1. Although one memoryarray is shown in FIG. 7, embodiments of the present disclosure are notso limited (e.g., memory device 710 can include more than one memoryarray coupled to controller 712).

Controller 712 can include, for example, control circuitry and/orfirmware. Controller 712 can be included on the same physical device(e.g., the same die) as memory array 700, or can be included on aseparate physical device that is communicatively coupled to the physicaldevice that includes memory array 700. For example, controller 712 canbe a controller of an array testing apparatus (e.g., a controller usedto perform testing operations on memory arrays such as array 700).

In this example, controller 712 includes control circuitry and/orfirmware to detect changes in resistance of memory cells in array 700.The control circuitry and/or firmware can be included on the samephysical device (e.g., the same die) as memory array 700, or can beincluded on a separate physical device that is communicatively coupledto the physical device that includes memory array 700. The controlcircuitry and/or firmware can be the circuitry illustrated in anddescribed in association with FIGS. 2-6.

Controller 712 can apply a number of signals in accordance with a numberof embodiments of the present disclosure to the memory cells (e.g., tothe storage elements of the memory cells) in memory array 700. Forexample, controller 712 can apply a programming signal previouslydescribed in connection with FIG. 1 to the storage element of the memorycells in memory array 700.

The embodiment illustrated in FIG. 7 can include additional circuitrythat is not illustrated so as not to obscure embodiments of the presentdisclosure. For example, memory device 710 can include address circuitryto latch address signals provided over I/O connectors through I/Ocircuitry. Address signals can be received and decoded by a row decoderand a column decoder, to access memory array 700. As an additionalexample, memory device 710 can include sense (e.g., read) circuitry.

Conclusion

The present disclosure includes apparatuses and methods for sensing aresistance variable memory cell. A number of embodiments includecircuitry to apply a programming signal to a memory cell in the array,the programming signal associated with programming resistance variablememory cells to a particular data state, and detect a change inresistance of the memory cell to determine if a data state of the memorycell changes from an initial data state to a different data state duringapplication of the programming signal.

It will be understood that when an element is referred to as being “on,”“connected to” or “coupled with” another element, it can be directly on,connected, or coupled with the other element or intervening elements maybe present. In contrast, when an element is referred to as being“directly on,” “directly connected to” or “directly coupled with”another element, there are no intervening elements or layers present. Asused herein, the term “and/or” includes any and all combinations of anumber of the associated listed items.

Although specific embodiments have been illustrated and describedherein, those of ordinary skill in the art will appreciate that anarrangement calculated to achieve the same results can be substitutedfor the specific embodiments shown. This disclosure is intended to coveradaptations or variations of a number of embodiments of the presentdisclosure. It is to be understood that the above description has beenmade in an illustrative fashion, and not a restrictive one. Combinationof the above embodiments, and other embodiments not specificallydescribed herein will be apparent to those of skill in the art uponreviewing the above description. The scope of the number of embodimentsof the present disclosure includes other applications in which the abovestructures and methods are used. Therefore, the scope of a number ofembodiments of the present disclosure should be determined withreference to the appended claims, along with the full range ofequivalents to which such claims are entitled.

In the foregoing Detailed Description, some features are groupedtogether in a single embodiment for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted asreflecting an intention that the disclosed embodiments of the presentdisclosure have to use more features than are expressly recited in eachclaim. Rather, as the following claims reflect, inventive subject matterlies in less than all features of a single disclosed embodiment. Thus,the following claims are hereby incorporated into the DetailedDescription, with each claim standing on its own as a separateembodiment.

What is claimed is:
 1. An apparatus, comprising: an array of resistancevariable memory cells; and circuitry coupled to the array and configuredto: apply a programming signal to a memory cell in the array, theprogramming signal associated with programming resistance variablememory cells to a particular data state; and detect a change inresistance of the memory cell to determine if a data state of the memorycell changes from an initial data state to a different data state duringapplication of the programming signal based on a first signal generatedduring a first time period while applying the programming signal and asecond signal generated during a second time period while applying theprogramming signal.
 2. The apparatus of claim 1, wherein the circuitryconfigured to detect the change in resistance of the memory cellincludes a comparator to compare the first signal to the second signal.3. The apparatus of claim 1, wherein the first signal corresponds to thevoltage of the memory cell as the programming signal is initiallyapplied to the memory cell.
 4. The apparatus of claim 1, wherein thecircuitry is configured to detect the change in resistance of the memorycell when the first signal is different from the second signalassociated with the memory cell.
 5. The apparatus of claim 1, whereinthe circuitry is configured not to detect the change in resistance ofthe memory cell when the first signal is the same as the second signal.6. The apparatus of claim 1, wherein the circuitry is configured toapply the programming signal by ramping the programming signal through arange of currents associated with programming memory cells to theparticular data state
 7. The apparatus of claim 1, wherein the circuitryis configured to store the first signal on a capacitor.
 8. An apparatus,comprising: an array of resistance variable memory cells; and circuitry,coupled to the array, that includes a first number of inverters andsecond number of inverters to determine a data state of a memory cell bydetecting a change in resistance of the memory cell when a programmingsignal is applied to the memory cell.
 9. The apparatus of claim 8,wherein the first number of inverters and the second number of invertersreceive a signal associated with the memory cell and are configured topass the signal associated with the memory cell to indicate the datastate of the memory cell.
 10. The apparatus of claim 9, wherein thefirst number of inverters are configured to pass the signal associatedwith the memory cell when the resistance of the memory cell correspondsto a data state associated with the programming signal.
 11. Theapparatus of claim 9, wherein the second number of inverters areconfigured to pass the signal associated with the memory cell when theresistance of the memory cell corresponds to a data state that isdifferent from a data state associated with the programming signal. 12.The apparatus of claim 9, wherein the first number of inverters areconfigured with trip points to pass signals that correspond to a datastate associated with the programming signal.
 13. The apparatus of claim9, wherein the second number of inverters are configured with trippoints to pass signals that correspond to a data state that is differentfrom a data state associated with the programming signal.
 14. Theapparatus of claim 8, wherein the circuitry outputs the data state to alatch based on the signal passed from the first and second number ofinverters.
 15. A method, comprising: applying a programming signal to amemory cell in the array; and determining a data state of the memorycell by comparing a first signal generated during a first time periodwhile applying the programming signal to a second signal generatedduring a second time period while applying the programming signal. 16.The method of claim 15, further including storing the first signal on acapacitor and wherein the first signal corresponds to a data stateassociated with the memory cell when the memory cell was previouslyprogrammed.
 17. The method of claim 15, further including sampling thefirst signal during the first time period.
 18. The method of claim 15,wherein inputting the first signal and the second signal into acomparator during the second time period that is after the first timeperiod.
 19. The method of claim 15, further including determining thedata state of the memory cell is the data state associated with theprogramming signal when the first signal and the second signal have asame magnitude.
 20. The method of claim 15, further includingdetermining the data state of the memory cell is different from the datastate associated with the programming signal when the first signal andthe second signal are different.